Monday, December 04, 2006
December 4, 2006, Toronto, ON: Sidense Corporation announced today that Xerxes Wania, CEO of the company will be taking part in the IP/SOC 2006 (IP-Based SoC Design) conference December 6th and 7th in Grenoble, France.
Mr. Wania is part of a panel discussing the integration of nonvolatile memory in SoC designs.
This is the 15th year for the event, which for the past six years has focused on IP-based SoC design. The conference and exhibition is held in the well known Silicon and Alliance Nanometer Valley in the French Alps.
“I am excited to be taking part in this conference. It’s an opportunity for me to discuss some of the advances we have made lately in non volatile memory cores and raise Sidense’ profile in the international system-on-chip design community”, said Mr. Wania.
The panel will describe traditional and some emerging NVM technologies, including the strong and weak points of each, followed by a Q&A session with the audience to address specific performance, security and cost concerns for different types of designs.
Sidense Corp. focuses on developing non-volatile memory IP cores to be embedded onto standard logic CMOS ASICs and custom integrated circuits. Sidense' 1T-FuseTM technology is ideal for feature sizes of 180nm and smaller. Applications include electrical fuse replacement, flash and mask programmable ROM replacement, code storage, RFID, unique ID, encryption, key storage and digital rights management (DRM). The company has offices in Mississauga and Ottawa, Canada and sales offices in San Francisco, CA and Tokyo, Japan. For more information, visit http://www.sidense.com.