Thursday, November 12, 2009
Embedded OTP Leader Sidense Hires NVM Veteran Humes as Product Engineering VP
Ottawa, Canada - November 12th, 2009 - Sidense, a leading developer of Logic Non-Volatile Memory (NVM) IP cores, today announced the appointment of Todd Humes as the company’s new Vice President of Product Engineering. Mr. Humes will report to CEO and President Xerxes Wania and will be responsible for working with the engineering team to optimize the cost, quality, performance, reliability, manufacturability and user features of Sidense’s non-volatile memory (NVM) IP products.
Mr. Humes brings over 20 years of engineering and management experience to Sidense. Following the acquisition of Impinj’s IP group, he was Senior Director of Engineering at Virage Logic for the Embedded NVM Group. Prior to working at Virage Logic, Mr. Humes joined Impinj at its inception and served as Chief Technical Officer and, later, Vice President of Engineering for IP products. Before Impinj, he held several management and engineering positions at TRW. Mr. Humes earned his M.S. in Electrical Engineering from the California Institute of Technology and B.S. in Electrical Engineering from California Polytechnic State University, San Luis Obispo. He currently holds 38 United States patents and has numerous U.S. and foreign patent applications.
“I am very excited about working with the talented engineering team at Sidense,” stated Mr. Humes. “Joining the industry leader in low-cost, secure and highly reliable logic NVM gives me the opportunity to help develop OTP products that can enhance the performance and features of virtually every system-on-chip in the marketplace.”
Sidense Corp., the only logic non-volatile memory provider listed on EE Times 60 Emerging Startups list for 2010, provides secure, dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture (U.S. Patent #7,402,855 and others) provides the industry’s smallest footprint, most reliable and lowest power Logic Non-Volatile Memory IP solution and offers an alternative solution to Flash, mask ROM and eFuse in many applications.
Sidense OTP memory is available at 180nm, 130nm, 110nm, 90nm, 65nm, and 55nm and is scalable to 40nm and below. The IP is available at all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, visit www.sidense.com.
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